© Skyarna Ltd 2012

Ltd.

 

Paul Munday BEng (Hons.), MIET

 

Paul has spent his career working in the field of high tech research into RF technologies, circuits and systems for a wealth of commercial and military applications. His primary experience is in the development of novel low cost circuit packaging techniques for high frequency and mm-wave applications that underpin numerous security screening, communications and radar systems from 1 to >100GHz. In addition, Paul has experience of the wider fields of MMIC circuit design, novel semiconductor process development and both on-wafer and in-package circuit testing. Paul has either authored or co-authored numerous technical papers and patent applications.

 

In the past five years Paul’s work has included: