© Skyarna Ltd 2012

Ltd.

 

Skyarna’s partners have worked for many years on perfecting leading edge MMIC circuit design and packaging techniques for microwave and millimetre-wave applications. MMIC circuits have been designed on many processes (e.g. WIN GaAs, NGST GaAs, HRL InP, Ommic mHEMT). Many different packaging techniques have been developed (metal waveguide, multi-layer organic soft board). This work culminated in the design and build of a 65 GHz transceiver for broad band communications and many receivers for passive millimetre-wave imaging. The passive millimetre-wave imager work required broad frequency range MMIC LNA and detector design plus packaging to achieve >50 dB flat gain in a single low cost unit. 100’s of receivers were manufactured at several frequency ranges. The transceiver work has recently been progressed for E-band communications.

 

The innovative work of Skyarna designers contributed to the following published papers:

 

Publications